Laser induced thermal imaging apparatus and fabricating method of organic light emitting diode using the same

ABSTRACT

A laser induced thermal imaging apparatus and a fabricating method of organic light emitting diodes using the same, which laminate an acceptor substrate and a donor film using a magnetic force in vacuum, and are used to form a pixel array on the acceptor substrate. A substrate stage includes a magnet or magnetic substance. The acceptor substrate has a pixel region for forming first, second, and third sub-pixels, and the donor film has an organic light emission layer to be transferred to the pixel region. A laser oscillator irradiates a laser to the donor film. A contact frame is adapted to be disposed between the substrate stage and the laser oscillator, and is used to form a magnetic force with the substrate stage. The contact frame includes an opening through which the laser passes. A contact frame feed mechanism moves the contact frame in a direction of the substrate stage.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.12/882,178, filed Sep. 14, 2010, which is a divisional of U.S. patentapplication Ser. No. 11/507,792, filed Aug. 21, 2006 which claims thebenefit of and priority to Korean Patent Application Nos.10-2005-0080341, 10-2005-0080342, 10-2005-0080343, 10-2005-0080344,10-2005-0080345, and 10-2005-0080346, all filed on Aug. 30, 2005 in theKorean Intellectual Property Office, the entire contents of all of whichare incorporated herein by reference.

BACKGROUND

1. Field of the Invention

The present invention relates to a laser induced thermal imagingapparatus and a fabricating method of an organic light emitting diodeusing the same, and more particularly to a laser induced thermal imagingapparatus and a fabricating method of an organic light emitting diodeusing the same, which laminate a donor film and an acceptor substrateusing magnetic force.

2. Discussion of Related Art

An organic light emitting device includes a light emitting layer formedbetween the first and second electrodes, and emits light when a voltageis applied between the electrodes. A laser induced thermal imaging(LITI) process may be used to fabricated the organic light emittingdevice.

In general, at least a laser, an acceptor substrate and a donorsubstrate (or donor film) are needed for the laser induced thermalimaging. In a laser induced thermal imaging method, the laser isradiated to a donor substrate including a base substrate, alight-to-heat conversion layer (LTHC) and a transfer layer (or imaginglayer) to convert the laser that passes through the base substrate intoheat at the light-to-heat conversion layer, such that the light-to-heatconversion layer is deformed and expanded. This way, the transfer layeradjacent to the light-to-heat conversion layer is also deformed andexpanded, and transferred to (or imaged on) the acceptor substrate.

When performing the laser induced thermal imaging method, a chamber inwhich the transfer is performed typically becomes a vacuum state.However, in the prior art, there has been a problem in that the transferlayer is not transferred well because space (or a gap) or impurities arecreated between the donor substrate and the accepter substrate when alaser-to-heat conversion is performed in the vacuum state. Therefore, inthe laser induced thermal imaging method, a method of laminating thedonor and accepter substrates is important, and to resolve the problemswith the space or the impurities, various methods have beeninvestigated.

FIG. 1 is a cross-sectional view that shows a prior art laser inducedthermal imaging apparatus 10 for resolving the above-mentioned problem.According to FIG. 1, the laser induced thermal imaging apparatus 10includes a substrate stage 12 placed in a chamber 11 and a laserradiating apparatus 13 placed at an upper portion of the chamber 11. Thesubstrate stage 12 is a stage for placing an accepter substrate 14 and adonor film 15 introduced in the chamber 11 in turn.

The acceptor substrate 14 and the donor film 15 are laminated to eachother prior to transferring the transfer layer of the donor film 15 tothe acceptor substrate 14. During lamination, the chamber 11 istypically not maintained in the vacuum state, but a vacuum pump P isused to absorb impurities. Since the chamber is not in a vacuum stateduring lamination, the reliability or the lifetime of the resultingorganic light emitting device can be reduced because of oxygen,moisture, or the like in the chamber 11.

On the other hand, when the chamber 11 is maintained in the vacuum stateduring lamination, it is difficult to absolutely prevent creation ofimpurities 1 and space between the accepter substrate 14 and the donorfilm 15.

SUMMARY OF THE INVENTION

Accordingly, it is an aspect of the present invention to provide a laserinduced thermal imaging apparatus and a fabricating method of organiclight emitting diodes using the same, which laminate an acceptorsubstrate and a donor film using a magnetic force in a vacuum state, andare used for forming a pixel array on the acceptor substrate.

The foregoing and/or other aspects of the present invention are achievedby providing a laser induced thermal imaging apparatus including: asubstrate stage including a magnet or magnetic substance, the acceptorsubstrate and a donor film being sequentially fed and laminated on thesubstrate stage, the acceptor substrate having a pixel definition regionin which first, second, and third sub-pixels are formed in a stripepattern, the donor film having an organic light emission layer to betransferred on the pixel definition region; a laser oscillator forirradiating a laser to the donor film; a contact frame adapted to bedisposed between the substrate stage and the laser oscillator forforming a magnetic force with the substrate stage, and including anopening through which the laser passes; and a contact frame feedmechanism for moving the contact frame in a direction of the substratestage.

According to another aspect of a first embodiment of the presentinvention, there is provided a method for fabricating an organic lightemitting diode having an emission layer formed between electrodes by thelaser induced thermal imaging apparatus, the method including: placingan acceptor substrate having a pixel definition region in which first,second, and third sub-pixels are formed in a stripe pattern, on asubstrate stage having a magnet; placing a donor film having an organiclight emission layer to be transferred on the pixel definition region,on the acceptor substrate; adhering a first contact frame to a firstdonor film using magnetic attraction, the first contact frame having amagnet, a first opening being formed at the first contact frame, a laserfor transferring a first color organic light emission layer passingthrough the opening; irradiating the laser to the first donor filmthrough the first opening of the first contact frame to transfer thefirst color organic light emission layer to a first sub-pixel region;separating the first contact frame from the first donor film; placing asecond donor film having a second color organic light emission layer onthe acceptor substrate in place of the first donor film; adhering asecond contact frame to a second donor film using magnetic attraction,the second contact frame having a magnet, a second opening being formedat the second contact frame, a laser for transferring a second colororganic light emission layer passing through the second opening;irradiating the laser to the second donor film through the secondopening of the second contact frame to transfer the second color organiclight emission layer to a second sub-pixel region; separating the secondcontact frame from the second donor film; placing a third donor filmhaving a third color organic light emission layer on the acceptorsubstrate in place of the second donor film; adhering a third contactframe to a third donor film using magnetic attraction, the third contactframe having a magnet, a third opening being formed at the third contactframe, a laser for transferring a third color organic light emissionlayer passing through the third opening; and irradiating the laser tothe third donor film through the third opening of the third contactframe to transfer the third color organic light emission layer to athird sub-pixel region.

According to another aspect of a second embodiment of the presentinvention, laser induced thermal imaging apparatus includes: a substratestage including a magnet or magnetic substance, the acceptor substrateand a donor film being sequentially fed and laminated on the substratestage, the acceptor substrate having a pixel definition region in whichfirst, second, and third sub-pixels are formed in a mosaic pattern, thedonor film having an organic light emission layer to be transferred onthe pixel definition region; a laser oscillator for irradiating a laserto the donor film; a contact frame adapted to be disposed between thesubstrate stage and the laser oscillator for forming a magnetic forcewith the substrate stage, and including an opening through which thelaser passes; and a contact frame feed mechanism for moving the contactframe in a direction of the substrate stage.

According to another aspect of a second embodiment of the presentinvention, there is provided a method for fabricating an organic lightemitting diode having an emission layer formed between electrodes by thelaser induced thermal imaging apparatus, the method including: placingan acceptor substrate having a pixel definition region in which first,second, and third sub-pixels are formed in a mosaic pattern, on asubstrate stage having a magnet; placing a donor film having an organiclight emission layer to be transferred on the pixel definition region,on the acceptor substrate; adhering a first contact frame to a firstdonor film using magnetic attraction, the first contact frame having amagnet, a first opening being formed at the first contact frame, a laserfor transferring a first color organic light emission layer passingthrough the opening; irradiating the laser to the first donor filmthrough the first opening of the first contact frame to transfer thefirst color organic light emission layer to a first sub-pixel region;separating the first contact frame from the first donor film; placing asecond donor film having a second color organic light emission layer onthe acceptor substrate in place of the first donor film; adhering asecond contact frame to a second donor film using magnetic attraction,the second contact frame having a magnet, a second opening being formedat the second contact frame, a laser for transferring a second colororganic light emission layer passing through the second opening;irradiating the laser to the second donor film through the secondopening of the second contact frame to transfer the second color organiclight emission layer to a second sub-pixel region; separating the secondcontact frame from the second donor film; placing a third donor filmhaving a third color organic light emission layer on the acceptorsubstrate in place of the second donor film; adhering a third contactframe to a third donor film using magnetic attraction, the third contactframe having a magnet, a third opening being formed at the third contactframe, a laser for transferring a third color organic light emissionlayer passing through the third opening; and irradiating the laser tothe third donor film through the third opening of the third contactframe to transfer the third color organic light emission layer to athird sub-pixel region.

According to an aspect of a third embodiment of the present invention,there is provided a laser induced thermal imaging apparatus including: asubstrate stage including a magnet or a magnetic substance, the acceptorsubstrate and a donor film being sequentially fed and laminated on thesubstrate stage, the acceptor substrate having a pixel definition regionin which first, second, and third sub-pixels are formed in a deltapattern, the donor film having an organic light emission layer to betransferred on the pixel definition region; a laser oscillator forirradiating a laser to the donor films; a contact frame adapted to bedisposed between the substrate stage and the laser oscillator forforming a magnetic force with the substrate stage, and including anopening through which the laser passes; and a contact frame feedmechanism for moving the contact frame in a direction of the substratestage.

According to another aspect of a third embodiment of the presentinvention, there is provided a method for fabricating an organic lightemitting diode having an emission layer formed between electrodes by thelaser induced thermal imaging apparatus, the method including: placingan acceptor substrate having a pixel definition region in which first,second, and third sub-pixels are formed in a delta pattern, on asubstrate stage having a magnet; placing a donor film having an organiclight emission layer to be transferred on the pixel definition region,on the acceptor substrate; adhering a first contact frame to a firstdonor film using magnetic attraction, the first contact frame having amagnet, a first opening being formed at the first contact frame, a laserfor transferring a first color organic light emission layer passingthrough the opening; irradiating the laser to the first donor filmthrough the first opening of the first contact frame to transfer thefirst color organic light emission layer to a first sub-pixel region;separating the first contact frame from the first donor film; placing asecond donor film having a second color organic light emission layer onthe acceptor substrate in place of the first donor film; adhering asecond contact frame to a second donor film using magnetic attraction,the second contact frame having a magnet, a second opening being formedat the second contact frame, a laser for transferring a second colororganic light emission layer passing through the second opening;irradiating the laser to the second donor film through the secondopening of the second contact frame to transfer the second color organiclight emission layer to a second sub-pixel region; separating the secondcontact frame from the second donor film; placing a third donor filmhaving a third color organic light emission layer on the acceptorsubstrate in place of the second donor film; adhering a third contactframe to a third donor film using magnetic attraction, the third contactframe having a magnet, a third opening being formed at the third contactframe, a laser for transferring a third color organic light emissionlayer passing through the third opening; and irradiating the laser tothe third donor film through the third opening of the third contactframe to transfer the third color organic light emission layer to athird sub-pixel region.

According to an aspect of a fourth embodiment of the present invention,there is provided a laser induced thermal imaging apparatus for formingan emission layer of an organic light emitting diode in which one pixelincludes at least three sub-pixels having first to third emissionlayers, at least one of the first to third emission layers is formed atan entire surface of a pixel portion in common, the apparatus including:a chamber including a substrate stage and a contact frame, the substratestage having a magnet or a magnet material, and the contact frame beingadapted to be disposed between the substrate stage and a laseroscillator, and a laser induced thermal imaging is performed in thechamber; the laser oscillator for irradiating a laser to the contactframe and a donor film; and a contact frame feed mechanism for movingthe contact frame in a direction of the substrate stage, wherein thecontact frame includes an opening, the first and second sub-pixels beingformed corresponding to the opening, and the substrate stage forming amagnetic force with the contact frame.

According to another aspect of a fourth embodiment of the presentinvention, there is provided a method for fabricating an organic lightemitting diode having an emission layer formed between first and secondelectrodes by the laser induced thermal imaging apparatus, the methodincluding: placing an acceptor substrate having first, second, and thirdsub-pixel regions constituting one pixel on a substrate stage having amagnet or magnetic substance; placing a donor film having an organiclight emission layer to be transferred on the pixel definition region,on the acceptor substrate; adhering a contact frame having a magnet ormagnetic substance to a first donor film using magnetic attraction, anopening being formed at the contact frame, a laser for transferringfirst and second color organic light emission layers passing through theopening; irradiating the laser from a laser oscillator to the firstdonor film through the opening of the contact frame to transfer thefirst color organic light emission layer to the first sub-pixel region;separating the contact frame from the first donor film; placing a seconddonor film having a second color organic light emission layer on theacceptor substrate in place of the first donor film; again adhering thecontact frame to a second donor film using magnetic attraction; andirradiating the laser from a laser oscillator to the second donor filmthrough the opening of the contact frame to transfer the second colororganic light emission layer to the second sub-pixel region, wherein anemission of the third sub-pixel is deposited and formed at a pixelportion region in which the pixels are formed.

According to an aspect of a fifth embodiment of the present invention,there is provided a laser induced thermal imaging apparatus including: asubstrate stage including a magnet, the acceptor substrate and a donorfilm being sequentially fed and laminated on the substrate stage, theacceptor substrate having a pixel definition region in which first andsecond sub-pixels, and two third sub-pixels constituting one pixel, thedonor film having an organic light emission layer to be transferred onthe pixel definition region; a laser oscillator for irradiating a laserto the donor film; a contact frame adapted to be disposed between thesubstrate stage and the laser oscillator, including magnetic substancefor forming a magnetic force with the substrate stage, and including anopening through which the laser passes; and a contact frame feedmechanism for moving the contact frame in a direction of the substratestage, wherein the contact frame includes first and second frames; firstand second openings are formed at the first and second frames; the firstand second sub-pixels are formed at the first opening, and two thirdsub-pixels are formed at the second opening, the first and second framesare alternately mounted to form an emission layer of an organic lightemitting diode.

According to another aspect of a fifth embodiment of the presentinvention, there is provided a method for fabricating an organic lightemitting diode having an emission layer formed between first and secondelectrodes by the laser induced thermal imaging apparatus, the methodincluding: placing an acceptor substrate having first and second pixelsregions, and two third sub-pixel regions constituting one pixel on asubstrate stage having a magnet; placing a donor film having an organiclight emission layer to be transferred on the pixel definition region,on the acceptor substrate; adhering a first contact frame having amagnet to a first donor film using magnetic attraction, an opening beingformed at the contact frame, a laser for transferring first and secondcolor organic light emission layers passing through the opening;irradiating the laser to the first donor film through the opening of thefirst contact frame to transfer the first color organic light emissionlayer to the first sub-pixel region; separating the first contact framefrom the first donor film; placing a second donor film having a secondcolor organic light emission layer on the acceptor substrate in place ofthe first donor film; again adhering the first contact frame to a seconddonor film using magnetic attraction; irradiating the laser to thesecond donor film through the opening of the first contact frame totransfer the second color organic light emission layer to the secondsub-pixel region; separating the first contact frame from the seconddonor film, and substituting the first contact frame by a second contactframe, the second contact frame including a magnet, and an opening isformed at the second contact frame, and a laser for transferring a thirdcolor organic light emission layer of the third donor film passingthrough the opening; placing a third donor film having the third colororganic light emission layer on the acceptor substrate in place of thesecond donor film; adhering the second contact frame to the third donorfilm using magnetic attraction; and irradiating the laser on the thirddonor film through the opening of the second contact frame to transferthe third color organic light emission layer to two third pixel regions.

According to an aspect of a sixth embodiment of the present invention,there is provided a laser induced thermal imaging apparatus for formingan emission layer of an organic light emitting diode including: achamber including a substrate stage and being adapted to receive acontact frame, the substrate stage having a magnet or a magnet material,and the contact frame being adapted to be disposed between the substratestage and a laser oscillator, and a laser induced thermal imaging isperformed in the chamber; the laser oscillator for irradiating a laserto the contact frame and a donor film; and a contact frame feedmechanism for moving the contact frame in a direction of the substratestage, the contact frame includes a magnet or magnetic substance, first,second, and third contact frames; a first sub-pixel, a second sub-pixel,and third two sub-pixels constituting one pixel, the first openingcorresponding to a first sub-pixel region being formed at the firstcontact frame, the second opening corresponding to a second sub-pixelregion being formed at the second contact frame, the third openingcorresponding to two third sub-pixel regions being formed at the thirdcontact frame; and the first, second, and third contact frames arealternately mounted to form an emission layer of an organic lightemitting diode.

According to another aspect of a sixth embodiment of the presentinvention, there is provided a method for fabricating an organic lightemitting diode having an emission layer formed between first and secondelectrodes by the laser induced thermal imaging apparatus, the methodincluding: placing an acceptor substrate having first and second pixelsregions, and two third sub-pixel regions constituting one pixel on asubstrate stage having a magnet or magnetic substance; placing a donorfilm having an organic light emission layer to be transferred on thepixel definition region, on the acceptor substrate; adhering a firstcontact frame having a magnet or magnetic substance to a first donorfilm using magnetic attraction, an opening being formed at the contactframe, a laser for transferring a first color organic light emissionlayer passing through the opening; irradiating the laser from a laseroscillator to the first donor film through the opening of the firstcontact frame to transfer the first color organic light emission layerto the first sub-pixel region; separating the first contact frame fromthe first donor film, and substituting the first contact frame by asecond contact frame, the second contact frame including a magnet ormagnetic substance, and an opening is formed at the second contactframe, and a laser for transferring a second color organic lightemission layer of the second donor film passing through the opening;placing a second donor film having the second color organic lightemission layer on the acceptor substrate in place of the first donorfilm; adhering the second contact frame to a second donor film usingmagnetic attraction; irradiating the laser from a laser oscillator tothe second donor film through the opening of the second contact frame totransfer the second color organic light emission layer to the secondsub-pixel region; separating the second contact frame from the seconddonor film, and substituting the first contact frame by a second contactframe, the second contact frame including a magnet or magneticsubstance, and an opening is formed at the third contact frame, and alaser for transferring a third color organic light emission layer of thethird donor film passing through the opening; placing a third donor filmhaving the third color organic light emission layer on the acceptorsubstrate in place of the second donor film; adhering the third contactframe to a third donor film using magnetic attraction; and irradiatingthe laser from a laser oscillator to the third donor film through theopening of the third contact frame to transfer the third color organiclight emission layer to the third sub-pixel region.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects and features of the invention will becomeapparent and more readily appreciated from the following description ofthe exemplary embodiments, taken in conjunction with the accompanyingdrawings of which:

FIG. 1 is a cross-sectional view showing a conventional laser inducedthermal imaging apparatus;

FIG. 2 is an exploded perspective view showing an embodiment of a laserinduced thermal imaging apparatus according to the present invention;

FIG. 3A and FIG. 3B are plan views respectively showing examples of asubstrate stage of the laser induced thermal imaging apparatus accordingto the present invention;

FIG. 4 is a view showing an example of a laser oscillator of the laserinduced thermal imaging apparatus according the present invention;

FIG. 5A, FIG. 5B, and FIG. 5C are perspective views respectively showinga first contact frame, a second contact frame, and a third contact frameaccording to a first embodiment of the present invention;

FIG. 5D is a plan view showing a pixel array of organic light emittingdiodes formed by the first, second, and third contact frames shown inFIGS. 5A, 5B, and 5C;

FIG. 6 is a perspective view showing a contact frame feed mechanism of alaser induced thermal imaging apparatus in one embodiment according tothe present invention;

FIG. 7 is a flow diagram that illustrates a fabricating method oforganic light emitting diodes according to a first embodiment of thepresent invention;

FIG. 8A, FIG. 8B, and FIG. 8C are plan views respectively showing afirst contact frame, a second contact frame, and a third contact frameaccording to a second embodiment of the present invention;

FIG. 8D is a plan view showing a pixel array of organic light emittingdiodes formed by the first, second, and third contact frames shown inFIGS. 8A, 8B, and 8C;

FIG. 9A and FIG. 9B are plan views respectively showing a first contactframe and a second contact frame according to a third embodiment of thepresent invention;

FIG. 9C is a plan view showing a pixel array of organic light emittingdiodes formed by the first and second contact frames shown in FIGS. 9Aand 9B;

FIG. 10 is a flow diagram that illustrates a fabricating method oforganic light emitting diodes according to the third embodiment of thepresent invention;

FIG. 11A is a plan view showing a contact frame according to a fourthembodiment of the present invention;

FIG. 11B is a plan view showing a pixel array of organic light emittingdiodes formed by the contact frame shown in FIG. 11A;

FIG. 12 is a flow diagram that illustrates a fabricating method oforganic light emitting diodes according to the fourth embodiment of thepresent invention;

FIG. 13A and FIG. 13B are plan views respectively showing one example ofa first contact frame and one example of a second contact frameaccording to a fifth embodiment of the present invention;

FIG. 13C is a plan view showing a pixel array of organic light emittingdiodes formed by the first and second contact frames shown in FIGS. 13Aand 13B;

FIG. 13D and FIG. 13E are plan views respectively showing anotherexample of a first contact frame and another example of a second contactframe according to the fifth embodiment of the present invention;

FIG. 13F is a plan view showing a pixel array of organic light emittingdiodes formed by the first and second contact frames shown in FIGS. 13Dand 13E;

FIG. 14 is a flow diagram that illustrates a fabricating method oforganic light emitting diodes according to the fifth embodiment of thepresent invention;

FIG. 15A, FIG. 15B and FIG. 15C are plan views respectively showing oneexample of a first contact frame, one example of a second contact frame,and one example of a third contact frame according to a sixth embodimentof the present invention;

FIG. 15D is a plan view showing a pixel array of an organic lightemitting diode formed by the first, second, and third contact framesshown in FIGS. 15A, 15B and 15C;

FIG. 15E, FIG. 15F and FIG. 15G are plan views respectively showinganother example of a first contact frame, another example of a secondcontact frame, and another example of a third contact frame according tothe sixth embodiment of the present invention;

FIG. 15H is a plan view showing a pixel array of an organic lightemitting diode formed by the first, second, and third contact framesshown in FIGS. 15E, 15F and 15G; and

FIG. 16 is a flow diagram that illustrates a fabricating method oforganic light emitting diodes according to the sixth embodiment of thepresent invention.

DETAILED DESCRIPTION Embodiment 1

Hereinafter, exemplary embodiments according to the present inventionwill be described with reference to the accompanying drawings. Here,when one element is described as being connected to another element,that element may be directly connected to another element or indirectlyconnected to another element via a third element. Further, some of theparts that are not essential to the complete understanding of theinvention have been omitted for clarity. Also, like reference numeralsrefer to like elements throughout. FIG. 2 is a perspective view showingan embodiment of a laser induced thermal imaging apparatus according tothe present invention. Referring to FIG. 2, the laser induced thermalimaging apparatus 100 includes a substrate stage 110, a laser oscillator120, a contact frame 130, a contact frame feed mechanism 140, and achamber 150.

First, a chamber for the laser induced thermal imaging apparatus 100 maybe used as the chamber 150. The substrate stage 110 and the contactframe 130 are mounted inside the chamber 150. A donor film 200 and anacceptor substrate 300 are fed into the chamber 150. For this, a feedmechanism (not shown) for feeding the donor film 200 and the acceptorsubstrate 300 into the chamber 150 is disposed outside the chamber 150.

The acceptor substrate 300 according to an embodiment of the presentinvention has a pixel definition region (or pixel region) in whichfirst, second, and third sub-pixels are formed in a stripe pattern, thedonor film 200 includes a transfer layer (or imaging layer) fortransferring an organic light emitting layer to the pixel definingregion of the acceptor substrate 300.

The substrate stage 110 is disposed at or near a lower surface of thechamber 150. In the described embodiment of the present invention, thesubstrate stage 110 is provided with at least one electromagnet (notshown in FIG. 2). However, it would be appreciated by those skilled inthe art that a permanent magnet or magnetic substance may be usedinstead of or in addition to the electromagnet without departing fromthe principles and spirit of the invention.

The electromagnet included in the substrate stage 110 will be describedwith reference to FIGS. 3A and 3B. FIGS. 3A and 3B are plan viewsrespectively showing that electromagnets 113 are concentrically formedor formed in a plurality of lines in the substrate stage 110. As shownin FIG. 3A, when the electromagnets 113 of the substrate stage 110 areconcentrically disposed, power is first applied to first electromagnets113 that define an innermost concentric circle 115. In this state, apower is applied to second electromagnets 113 that define a second innerconcentric circle 117 encircling the innermost concentric circle 115.Next, a power is applied to third electromagnets 113 that define aconcentric circle 119 outside the second inner concentric circle, withthe result that a magnetic attraction with a magnet of a contact frameto be described later is generated to achieve the laminating whileminimizing or reducing the occurrence of impurities or space between adonor film 200 a and the acceptor substrate 300.

Further, in the described embodiment, as shown in FIG. 3B, when theelectromagnets 113 of a substrate stage 110 are formed in a plurality oftransverse and longitudinal lines, a power is applied to only theelectromagnet 113 on which a laser is irradiated or only theelectromagnets 113 of a corresponding line, thereby generating amagnetic attraction with a magnet of a contact frame to be describedlater. Accordingly, a local laminating continues to be achieved betweena donor film 200 b and the acceptor substrate 300 at only parts on whicha laser is irradiated, with the result that the laminating is completedwhile minimizing or reducing the occurrence of space or impurities. Anelectric wiring for applying a power may be installed at eachelectromagnet.

The substrate stage 110 further includes a drive mechanism (not shown)for feeding the substrate stage 110. When the substrate stage 110 isfed, the laser oscillator 120 can be configured to irradiate a laser inone direction. For example, when a laser is irradiated in a longitudinaldirection and the substrate stage 110 further includes a drive mechanismfor feeding the substrate stage 110, a laser can be irradiated to anentire surface of the donor film 200.

Furthermore, the substrate stage 110 can further include a mountingmechanism for receiving and mounting the acceptor substrate 300 and thedonor film 200. The mounting mechanism is used to mount the acceptorsubstrate 300, and the donor film 200 is fed in the chamber 150 by afeed mechanism at a determined position of the substrate stage 110.

In the embodiment, the mounting mechanism may include through holes 410and 510, guide bars 420 and 520, moving plates 430 and 530, supportmembers 440 and 540, and mounting grooves 450 and 550. The guide bars420 ascend or descend with the moving plate 430 and the support member440. The guide bars 420 ascend through the through holes 410 to receivethe acceptor substrate 300. The guide bars 420 descend to mount theacceptor substrate 300 in a first mounting groove 450 formed on thesubstrate stage 110. Those skilled in the art would know how toimplement the mounting mechanism based on the disclosure herein.Further, the mounting mechanism can be changed by those skilled in theart, and is not limited thereto.

The laser oscillator 120 may be installed outside or inside a chamber150. The laser oscillator 120 may be installed such that a laser isprovided at an upper part. Referring to FIG. 4 showing a schematic viewof the laser oscillator 120, CW DN:YAG laser (1604 nm) may be used asthe laser oscillator of the embodiment. The laser oscillator includestwo galvano meter scanners 121 and 123, a scan lens 125, and a cylinderlens 127. However, the present invention is not limited thereto.

The contact frame 130 includes one or more electromagnets, one or morepermanent magnets, or magnetic substance. The contact frame 130 forms amagnetic force with a magnet of the substrate stage 110, so that thedonor film 200 and the acceptor substrate 300 disposed between thesubstrate stage 110 and the contact frame 130 are strongly laminated.The contact frame 130 includes opening grooves (or openings) 133 throughwhich a laser passes. Accordingly, the contact frame 130 also functionsas a mask to irradiate the laser at only a predetermined position. Inthe described embodiment, the magnetic substance includes ferromagneticsubstance and/or weak magnetic substance. In the described embodiment,the magnetic layer (or magnetic substance) is formed by one selectedfrom the group consisting of Fe, Ni, Cr, Fe₂O₃, Fe₃O₄, CoFe₂O₄, magneticnano particles, and a mixture thereof.

The contact frames include a first frame 130 a_1, a second frame 130b_1, and a third frame 130 c_1. First opening grooves 133 a_1 are formedat the first frame 130 a_1. First sub-pixels are formed corresponding tothe first opening grooves 133 a_1 according to an organic light emittinglayer to be transferred. Magnets or magnetic substance 137 a_1 arelocated at the first frame 130 a_1. Second opening grooves 133 b_1 areformed at the second frame 130 b_1. Second sub-pixels are formedcorresponding to second opening grooves 133 b_1 according to an organiclight emitting layer to be transferred. Magnets or magnetic substance137 b_1 are located at the second frame 130 b_1. Third opening grooves133 c_1 are formed at the third frame 130 c_1. Third sub-pixels areformed corresponding to the third opening grooves 133 c_1 according toan organic light emitting layer to be transferred. Magnets or magneticsubstance 137 c_1 are located at the third frame 130 c_1. The first,second, and third frames 130 a_1, 130 b_1, and 130 c_1 are alternatelymounted to form an emission layer of organic light emitting diodes.

Further, an opening groove may be formed at substantially an entiresurface of the contact frame. Hence, it can be manufactured to use onecontact frame. However, in this case, magnets may be installed at onlyedges of the contact frame, so that laminating due to a magnetic forcebetween the donor film and the acceptor substrate does not actuallyoccur as described herein. Accordingly, in one embodiment, an area ofthe magnet is equal to or greater than or equal to at least 50% of thatof the contact frame.

FIGS. 5A, 5B and 5C show an embodiment of the first, second, and thirdcontact frames, which are alternately mounted. FIG. 5D is a plan viewshowing a stripe pixel array of organic light emitting diodes formed bythe first, second, and third contact frames shown in FIGS. 5A, 5B and5C.

A plurality of first opening grooves 133 a_1 corresponding to which thefirst sub-pixels are formed, are formed at the first contact frame 130a_1 of FIG. 5A. A plurality of second opening grooves 133 b_1corresponding to which the second sub-pixels are formed, are formed atthe second contact frame 130 b_1 of FIG. 5B. A plurality of thirdopening grooves 133 c_1 corresponding to which the third sub-pixels areformed, are formed at the third contact frame 130 c_1 of FIG. 5C.

The contact frame feed mechanism 140 moves or reciprocates the contactframe 130 in a direction of the substrate stage, and can be manufacturedusing various different methods. As shown in FIG. 6, the contact framefeed mechanism 140 includes a holder 141, connecting bars 143, and adrive mechanism 145 (shown as a block diagram). The holder 141 includesa holding groove 142. The connecting bars 143 are connected to theholder 141 at an upper surface of the chamber 150. The drive mechanismdrives the connecting bars 143 and the holder 141 up and down. Here, asshown, when the feed mechanism feeds the contact frame 130, the contactframe 130 is fed in a state that it is mounted on a tray 135 having aholding projection 134.

The first contact frame 130 a_1 and the second contact frame 130 b_1 areexchanged by an exchange mechanism 147 (shown as a block diagram) suchas a robot arm. After the first sub-pixels are formed by using the firstcontact frame 130 a_1 disposed on the holder, the robot arm removes thefirst contact frame 130 a_1 from the holder to an outside, and positionsthe second contact frame 130 b_1 at the holder, thereby achieving theexchange to form the second sub-pixels.

Next, a method for forming organic light emitting diodes by using theaforementioned laser induced thermal imaging apparatus will be explainedwith reference to FIGS. 2, 5A-5C, and 7. A method for fabricatingorganic light emitting diodes having an emission layer formed betweenelectrodes by the laser induced thermal imaging apparatus includes anacceptor substrate feed step ST100, a first donor film feed step ST200,a first contact frame adhering step ST300, a first sub-pixel transferstep ST400, a first contact frame separating step ST500, a second donorfilm feed step ST600, a second contact frame adhering step ST700, asecond sub-pixel transfer step ST800, a second contact frame separatingstep ST900, a third donor film feed step ST1000, a third contact frameadhering step ST1100, and a third sub-pixel transfer step ST1200.

The acceptor substrate feed step ST100 feeds the acceptor substrate 300on which an organic light emission layer is formed on the substratestage 110 having magnets or magnetic substance. A pixel region isdefined at the acceptor substrate 300. An emission layer to betransferred is formed corresponding to the pixel region. A stripe typepixel is formed and arranged at the pixel region of the acceptorsubstrate 300.

The first donor film feed step ST200 feeds a first donor film having anemission layer to be transferred on the acceptor substrate 300. Here,the emission layer can be configured as one color, for example, redcolor.

The first contact frame adhering step ST300 adheres the first contactframe 130 a_1 to a first donor film using magnetic attraction. The firstcontact frame 130 a_1 includes magnets or magnetic substance. Firstopening grooves 133 a_1 are formed at the first contact frame 130 a_1,and a laser for transferring a first color organic light emission layerpasses through the first opening grooves 133 a_1. Here, a contact framefeed mechanism first feeds and adheres the first contact frame 130 a_1on the substrate stage 110, and further adheres it strongly usingmagnetic attraction.

The first sub-pixel transfer step ST400 expands and transfers a firstcolor organic light emission layer included in the first donor film on afirst sub-pixel region of the acceptor substrate 300 by irradiating alaser on the first donor film through the first opening grooves 133 a_1of the first contact frame 130 a_1. At this time, an irradiation rangeof the laser can be adjusted so that the laser is irradiated to only thefirst sub-pixel region among regions corresponding to the openinggrooves.

The first contact frame separating step ST500 separates the firstcontact frame 130 a_1 from the first donor film by first separating thefirst contact frame 130 a_1 by a magnetic repulsive force, and then byraising the contact frame to an upper portion of the chamber 150.

The second donor film feed step ST600 removes the first donor film froman upper portion of the acceptor substrate to an outside of the chamber,and feeds a second donor film having a second color organic lightemission layer on the acceptor substrate 300. That is, the donor filmfeed mechanism substitutes the second donor film for the first donorfilm.

The second contact frame adhering step ST700 adheres the second contactframe 130 b_1 to a second donor film using magnetic attraction. Thesecond contact frame 130 b_1 includes magnet or magnetic substance.Second opening groove 133 b_1 are formed at the second contact frame 130b_1, and a laser for transferring a second color organic light emissionlayer passes through the second opening grooves 133 b_1. Here, thecontact frame feed mechanism first feeds and adheres the second contactframe 130 b_1 on the substrate stage 110, and then adheres it stronglyby a magnetic attraction.

The second sub-pixel transfer step ST800 expands and transfers a secondcolor organic light emission layer included in the second donor film ona second sub-pixel region of the acceptor substrate 300 by irradiating alaser on the second donor film through the second opening grooves 133b_1 of the second contact frame 130 b_1. At this time, an irradiationrange of the laser can be adjusted so that the laser is irradiated toonly the second sub-pixel region among regions corresponding to theopening grooves.

The third donor film feed step ST1000 removes the second donor film froman upper portion of the acceptor substrate to an outside of the chamber,and feeds a third donor film having a third color organic light emissionlayer on the acceptor substrate 300. That is, the donor film feedmechanism substitutes a third donor film for the second donor film.

The third contact frame adhering step ST1100 adheres the third contactframe 130 c_1 to the third donor film using magnetic attraction. Thethird contact frame 130 c_1 includes magnets or magnetic substance.Third opening grooves 133 c_1 are formed at the third contact frame 130c_1, and a laser for transferring a third color organic light emissionlayer passes through the third opening grooves 133 c_1. Here, thecontact frame feed mechanism first feeds and adheres the third contactframe 130 c_1 on the substrate stage 110, and then adheres it stronglyusing magnetic attraction.

The third sub-pixel transfer step ST1200 expands and transfers a thirdcolor organic light emission layer included in the third donor film on athird sub-pixel region of the acceptor substrate 300 by irradiating alaser on the third donor film through the third opening grooves 133 c_1of the third contact frame 130 c_1. At this time, an irradiation rangeof the laser can be adjusted so that the laser is irradiated to only thethird sub-pixel region among regions corresponding to the openinggrooves.

In the described embodiment, a color of the first color organic lightemission layer transferred in the first sub-pixel transfer step ST400may be red, a color of the second color organic light emission layertransferred in the second sub-pixel transfer step ST800 may be green,and a color of the third color organic light emission layer transferredin the third sub-pixel transfer step ST1200 may be blue.

Alternatively, a color of the first color organic light emission layertransferred in the first sub-pixel transfer step ST400 may be green, acolor of the second color organic light emission layer transferred inthe second sub-pixel transfer step ST800 may be red, and a color of thethird color organic light emission layer transferred in the thirdsub-pixel transfer step ST1200 may be blue.

In describing the fabricating process, respective contact frame exchangesteps were not described. It would be appreciated by those skilled inthe art that the contact frame exchange steps should be performed.

Embodiment 2

Hereinafter, like or the same elements are designated by like or thesame numbers as are used in the first embodiment. Since an acceptorsubstrate and contact frames differ from those of the first embodiment,only the acceptor substrate and the contact frames will be described indetail.

As can be seen in FIG. 8D, an acceptor substrate 301 of a secondembodiment includes a pixel definition region. First sub-pixels, Secondsub-pixels, and Third sub-pixels are formed at the pixel definitionregion in a mosaic pattern. According to the mosaic pattern, sub-pixelsof different colors are sequentially and continuously formed.

FIGS. 8A, 8B and 8C show an embodiment of the first, second, and thirdcontact frames, which are alternately mounted. FIG. 8D is a plan viewshowing a mosaic pixel array of organic light emitting diodes formed bythe first, second, and third contact frames shown in FIGS. 8A, 8B and8C.

A plurality of first opening grooves 133 a_2 corresponding to which thefirst sub-pixels are formed, are formed at the first contact frame 130a_2 of FIG. 8A. Magnets or magnetic substance 137 a_2 are located at thefirst contact frame 130 a_2. A plurality of second opening grooves 133b_2 corresponding to which the second sub-pixels are formed, are formedat the second contact frame 130 b_2 of FIG. 8B. Magnets or magneticsubstance 137 b_2 are located at the second contact frame 130 b_2. Aplurality of third opening grooves 133 c_2 corresponding to which thethird sub-pixels are formed, are formed at the third contact frame 130c_2 of FIG. 8C. Magnets or magnetic substance 137 c_2 are located at thethird contact frame 130 c_2. Because a fabricating method of the secondembodiment is substantially identical to that of the first embodiment, adetailed description thereof is omitted.

Embodiment 3

Hereinafter, like or the same elements are designated by like or thesame numbers as are used in the first embodiment. Since an acceptorsubstrate and contact frames differ from those of the first embodiment,only the acceptor substrate and the contact frames will be described indetail.

FIGS. 9A and 9B show an embodiment of the first and second contactframes, which are alternately mounted. FIG. 9 c is a plan view showing adelta pixel array of organic light emitting diodes formed on an acceptorsubstrate 302 by the first and second contact frames shown in FIGS. 9Aand 9B. The third embodiment uses the acceptor substrate 302 to form adelta type pixel array. In the delta type pixel array, respectivesub-pixels are arranged in a delta pattern.

A plurality of first opening grooves 133 a_3 corresponding to which thefirst and second sub-pixels are formed, are formed at a first contactframe 130 a_3. A plurality of second opening grooves 133 b_3corresponding to which the third sub-pixels are formed, are formed at asecond contact frame 130 b_3. Here, two contact frames 130 a_3 and 130b_3 are alternately used.

A method for forming organic light emitting diodes according to thethird embodiment of the present invention by the aforementioned laserinduced thermal imaging apparatus will be described with reference toFIG. 2, FIGS. 9A-9C, and FIG. 10. A method for fabricating organic lightemitting diodes having an emission layer formed between electrodes bythe laser induced thermal imaging apparatus includes an acceptorsubstrate feed step ST2100, a first donor film feed step ST2200, a firstcontact frame adhering step ST2300, a first sub-pixel transfer stepST2400, a first contact frame separating step ST2500, a second donorfilm feed step ST2600, a first contact frame re-adhering step ST2700, asecond sub-pixel transfer step ST2800, a second contact frame exchangestep ST2900, a third donor film feed step ST3000, a second contact frameadhering step ST3100, and a third sub-pixel transfer step ST3200.

The acceptor substrate feed step ST2100 feeds the acceptor substrate 302on which an organic light emission layer is formed on the substratestage 110 having magnets or magnetic substance. A pixel region isdefined at the acceptor substrate 302. An emission layer to betransferred is formed corresponding to the pixel region. A stripe typepixel is formed and arranged at the pixel region of the acceptorsubstrate 302.

The first donor film feed step ST2200 feeds a first donor film having anemission layer to be transferred on the acceptor substrate 302. Here,the emission layer can be configured as one color, for example, redcolor.

The first contact frame adhering step ST2300 adheres the first contactframe 130 a_3 to a first donor film using magnetic attraction. The firstcontact frame 130 a 3 includes magnets or magnetic substance 137 a_3.First opening grooves 133 a_3 are formed at the first contact frame 130a_3, and a laser for transferring a first color organic light emissionlayer passes through the first opening grooves 133 a_3. Here, a contactframe feed mechanism first feeds and adheres the first contact frame 130a_3 on the substrate stage 110, and then adheres it strongly usingmagnetic attraction.

The first sub-pixel transfer step ST2400 expands and transfers a firstcolor organic light emission layer included in the first donor film on afirst sub-pixel region of the acceptor substrate 302 by irradiating alaser on the first donor film through first opening grooves 133 a_3 ofthe first contact frame 130 a_3. Here, an irradiation range of the lasercan be adjusted so that the laser is irradiated to only the firstsub-pixel region among regions corresponding to the opening grooves.

The first contact frame separating step ST2500 separates the firstcontact frame 130 a_3 from the first donor film by first separating thefirst contact frame 130 a_3 by a magnetic repulsive force, and then byraising the contact frame to an upper portion of the chamber 150 by acontact frame feed mechanism.

The second donor film feed step ST2600 removes the first donor film froman upper portion of the acceptor substrate to an outside of the chamber,and feeds a second donor film having a second color organic lightemission layer on the acceptor substrate 302. That is, the donor filmfeed mechanism substitutes the second donor film for the first donorfilm.

The first contact frame re-adhering step ST2700 again adheres the firstcontact frame 130 a_3 from the donor film in step ST2500 to a seconddonor film using magnetic attraction. Here, the contact frame feedmechanism first feeds and adheres the first contact frame 130 a_3 on thesubstrate stage 110, and then adheres it strongly using magneticattraction.

The second sub-pixel transfer step ST2800 expands and transfers a secondcolor organic light emission layer included in the second donor film ona second sub-pixel region of the acceptor substrate 302 by irradiating alaser on the second donor film through opening grooves of the firstcontact frame. At this time, an irradiation range of the laser can beadjusted so that the laser is irradiated to only the second sub-pixelregion among regions corresponding to the opening grooves.

The second contact frame exchange step ST2900 eliminates a magneticforce or generates a magnetic repulsive force between the first contactframe 130 a_3 and the substrate stage 110 to separate the first contactframe 130 a_3 from the second donor film, and then substitutes thesecond contact frame 130 b_3 for the first contact frame 130 a_3. Thesecond contact frame 130 b_3 has magnets or magnetic substance 137 b_3.Opening grooves 133 b_3 are formed at the second contact frame 130 b_3and a laser for transferring a third color organic light emission layerof the third donor film passes through the opening grooves 133 b_3.

The third donor film feed step ST3000 removes the second donor film froman upper portion of the acceptor substrate to an outside of the chamber,and feeds a third donor film having a third color organic light emissionlayer on the acceptor substrate 302. That is, the donor film feedmechanism substitutes the third donor film for the second donor film.

The second contact frame adhering step ST3100 adheres the second contactframe 130 b_3 to a third donor film using magnetic attraction. Thesecond contact frame 130 b_3 includes the magnets or magnetic substance137 b_3. Second opening grooves 133 b_3 are formed at the second contactframe 130 b_3, and a laser for transferring a third color organic lightemission layer passes through the second opening grooves 133 b_3. Here,the contact frame feed mechanism first feeds and adheres the secondcontact frame 130 b_3 on the substrate stage 110, and then adheres itstrongly using magnetic attraction.

The third sub-pixel transfer step ST3200 expands and transfers a thirdcolor organic light emission layer included in the third donor film on athird sub-pixel region of the acceptor substrate 302 by irradiating alaser on the third donor film through the opening grooves 133 b_3 of thesecond contact frame 130 b_3. Here, an irradiation range of the lasercan be adjusted so that the laser is irradiated to an entire region ofthe second contact frame 130 b_3.

In the described embodiment, a color of the first color organic lightemission layer transferred in the first sub-pixel transfer step ST2400may be red, a color of the second color organic light emission layertransferred in the second sub-pixel transfer step ST2800 may be green,and a color of the third color organic light emission layer transferredin the third sub-pixel transfer step ST3200 may be blue.

Alternatively, a color of the first color organic light emission layertransferred in the first sub-pixel transfer step ST2400 may be green, acolor of the second color organic light emission layer transferred inthe second sub-pixel transfer step ST2800 may be red, and a color of thethird color organic light emission layer transferred in the thirdsub-pixel transfer step ST3200 may be blue.

Embodiment 4

Hereinafter, like or the same elements in the fourth embodiment aredesignated by like or the same numbers as are used in the firstembodiment. Since an acceptor substrate and contact frames differ fromthose of the first embodiment, only the acceptor substrate and thecontact frames will be described in detail.

FIG. 11A shows an embodiment of a contact frame 130_4. FIG. 11B is aplan view showing a pixel array of organic light emitting diodes formedby the contact frame 130_4 shown in FIG. 11A. In order to form amagnetic force with magnets or magnetic substance of the substrate stageto strongly laminate the acceptor substrate 304 and a donor filmpositioned between the substrate stage 110 and the contact frame 130_4,the contact frame 130_4 includes magnets, which may be electromagnets orpermanent magnets, or the contact frame itself may be formed usingmagnetic substance in the described embodiment. At least one of thesubstrate stage 110 or the contact frame 130_4 should include magnets.

Furthermore, the contact frame 130_4 includes opening grooves 133_4through which a laser passes. The contact frame 130_4 is used forlamination, and can concurrently function as a mask to cause the laserto be irradiated to predetermined positions. The opening grooves 133_4can be variously set according to a pixel array having an organic lightemission layer to be transferred. For example, when only the first andsecond sub-pixels among the first to third sub-pixels in one pixel isformed by a laser induced thermal imaging method, and a common layer isdeposited all over a pixel portion to form a third sub-pixel, openinggrooves 133_4 can be formed at formation positions of the first andsecond sub-pixels, which are arranged adjacent to each other in the samerow. In the described embodiment, the first, second, and thirdsub-pixels are red, green, and blue, respectively. However, the presentinvention is not limited thereto.

Here, the opening grooves 133_4 for forming the first and secondsub-pixels are formed in common. Accordingly, the first and secondsub-pixels are formed using the same contact frame 130_4 to transfer anemission layer of the first and second sub-pixels at an exact positionby controlling a laser beam. This causes the number of contact frames tobe reduced and a process to be simplified. After the emission layer ofthe first and second sub-pixels is formed, the acceptor substrate 304 isfed into a deposition chamber (not shown in FIG. 11A) and thirdsub-pixels are formed by a thermal deposition. At this time, since aspecial mask process is unnecessary, a process is further simplified.

Referring to FIG. 11B showing a pixel portion in which a pixel is formedusing the aforementioned contact frame 130_4, one pixel includes firstto third sub-pixels. A region other than formation regions of the firstand second sub-pixels becomes a third sub-pixel region.

A method for forming organic light emitting diodes according to thefourth embodiment of the present invention will be described withreference to FIG. 2 and FIG. 12. A method for fabricating organic lightemitting diodes includes an acceptor substrate feed step ST4000, a firstdonor film feed step ST4100, a contact frame adhering step ST4200, afirst sub-pixel transfer step ST4300, a contact frame separating stepST4400, a second donor film feed step ST4500, a contact framere-adhering step ST4600, and a second sub-pixel transfer step ST4700.

The acceptor substrate feed step ST4000 feeds the acceptor substrate 304in which an organic light emission layer is formed on a mounting groove450 of the substrate stage 110 having magnets or magnetic substance. Apixel region is defined at the acceptor substrate 304. An emission layerto be transferred from the donor film 200 is formed corresponding to thepixel region. In the pixel region of the acceptor substrate 304, threesub-pixels constitute one pixel. In the sub-pixels, a part other thanthe first and second sub-pixel regions is a third sub-pixel region,according to the described embodiment.

The first donor film feed step ST4100 feeds a first donor film on theacceptor substrate 304. An emission layer to be transferred at the firstsub-pixel region of the acceptor substrate 304 is formed at the firstdonor film. Here, the emission layer can be configured as one color, forexample, red color.

The contact frame adhering step ST4200 adheres the contact frame 1304 toa first donor film using magnetic attraction. The contact frame 130_4includes magnets or magnetic substance 137_4. Opening grooves 133_4 areformed at the contact frame 130_4, and a laser for transferring a firstcolor organic light emission layer passes through the first openinggrooves 133_4. In the described embodiment, a contact frame feedmechanism first feeds and adheres the contact frame 130_4 on thesubstrate stage 110, and then adheres it strongly using magneticattraction between the substrate stage 110 and the contact frame 130_4.

The first sub-pixel transfer step ST4300 expands and transfers a firstcolor organic light emission layer included in the first donor film onthe first sub-pixel region of the acceptor substrate 304 by irradiatinga laser on the first donor film through the opening grooves 133_4 of thecontact frame 130_4. At this time, an irradiation range of the laser canbe adjusted so that the laser is irradiated to only the first sub-pixelregion among regions corresponding to the opening grooves.

The contact frame separating step ST4400 separates the contact frame 130a_4 from the first donor film by first separating the first contactframe 130_4 by a magnetic repulsive force, and then by raising thecontact frame to an upper portion of the chamber 150 by the contactframe feed mechanism 140.

The second donor film feed step ST4500 removes the first donor film froman upper portion of the acceptor substrate 110 to an outside of thechamber 150, and feeds a second donor film on the acceptor substrate304. Here, the second donor film includes an emission layer to betransferred at the second sub-pixel region of the acceptor substrate130_4. The emission layer is formed to have a second color, for example,a green color.

The contact frame re-adhering step ST4600 adheres the contact frame130_4 to a second donor film using magnetic attraction. Here, thecontact frame 130_4 includes the opening grooves 133_4 through which alaser for transferring a second color organic light emission layer ofthe second donor film passes.

The second sub-pixel transfer step ST4700 expands and transfers a secondcolor organic light emission layer included in the second donor film ona second sub-pixel region of the acceptor substrate 304 by irradiating alaser on the second donor film through the opening grooves 133_4 of thecontact frame 130_4. At this time, an irradiation range of the laser canbe adjusted so that the laser is irradiated to only the second sub-pixelregion among regions corresponding to the opening grooves 133_4.

As described earlier, after organic light emission layers of the firstand second sub-pixels are formed, the acceptor substrate 304 is fed in adeposition chamber, so that an organic light emission layer of thirdsub-pixels can be formed. Here, the organic light emission layer of thethird sub-pixels can be formed at the pixel region in common by thermaldeposition. In the described embodiment, the third sub-pixels are blue.

In the described embodiment, the aforementioned steps are performed in avacuum chamber 150, and a laser irradiation method can vary according toan arrangement of organic light emission layers to be transferred inrespective transfer steps. For example, the first to third sub-pixelsform a 1×3 matrix, and constitutes one pixel, and the first colororganic light emission layer is transferred to be formed in a first rowand a first column, and the second color organic light emission layer istransferred to be formed in the first row and a second column.

Embodiment 5

Hereinafter, like or the same elements in the fourth embodiment aredesignated by like or the same numbers as are used in the firstembodiment. Since an acceptor substrate and contact frames differ fromthose of the first embodiment, only the acceptor substrate and thecontact frames will be described in detail. FIG. 13A and FIG. 13B areplan views showing one example of a first contact frame 130 a_5 and oneexample of a second contact frame 130 b_5 according to a fifthembodiment of the present invention, respectively. FIG. 13C shows apixel array formed using the first and second contact frames 130 a_5 and130 b_5 on an acceptor substrate 305.

A plurality of opening grooves 133 a_5 are formed at the first contactframe 130 a_5 of FIG. 13A, and first sub-pixels and second sub-pixelsare formed corresponding to the opening grooves 133 a_5. A plurality ofopening grooves 133 b_5 are formed at the second contact frame 130 b_5of FIG. 13B. When the second contact frame 130 b_5 is overlapped withthe first contact frame 130 a_5, two third sub-pixels positioned at alower portion of the opening grooves 133 a_5 of the first contact frame130 a_5, are formed corresponding to the opening grooves 133 b_5. Eachcontact frame includes magnets or magnetic substance 137 a_5 or 137 b_5.FIG. 13C shows a pixel array of an acceptor substrate corresponding tothe first and second contact frames 130 a_5 and 130 b_5.

FIGS. 13D and 13E show another embodiment of the first and secondcontact frames, which are alternately mounted. FIG. 13F shows a pixelarray formed by the first contact frame 130 d_5 and the second contactframe 130 e_5. A plurality of opening grooves 133 d_5 are formed at thefirst contact frame 130 d_5 of FIG. 13D, and first sub-pixels and secondsub-pixels are formed corresponding to the opening grooves 133 d_5. Aplurality of opening grooves 133 e_5 are formed at the second contactframe 130 e_5 of FIG. 13E. Using the second contact frame 130 e_5 andthe first contact frame 130 d_5, two third sub-pixels positioned at aleft side of the first contact frame 130 d_5, are formed correspondingto the opening grooves 133 d_5. Each contact frame includes magnets ormagnetic substance 137 d_5 or 137 e_5. FIG. 13F shows a pixel array ofan acceptor substrate fabricated using the first and second contactframes 130 d_5 and 130 e_5.

A method for forming organic light emitting diodes according to thefifth embodiment of the present invention will be described withreference to FIG. 2 and FIG. 14. A method for fabricating organic lightemitting diodes having an emission layer formed between electrodes bythe laser induced thermal imaging apparatus includes an acceptorsubstrate feed step ST5100, a first donor film feed step ST5200, a firstcontact frame adhering step ST5300, a first sub-pixel transfer stepST5400, a first contact frame separating step ST5500, a second donorfilm feed step ST5600, a first contact frame re-adhering step ST5700, asecond sub-pixel transfer step ST5800, a second contact frame exchangestep ST5900, a third donor film feed step ST6000, a second contact frameadhering step ST6100, and a third sub-pixel transfer step ST6200.

The acceptor substrate feed step ST5100 feeds the acceptor substrate 305or 306 in which an organic light emission layer is formed on thesubstrate stage 110 having magnets or magnetic substance. A pixel regionis defined at the acceptor substrate 305 or 306. An emission layer to betransferred is formed corresponding to the pixel region. The pixelregion of the acceptor substrate 305 or 306 is formed so that foursub-pixels constitute one pixel.

The first donor film feed step ST5200 feeds a first donor film having anemission layer to be transferred on the acceptor substrate 305 or 306.Here, the emission layer can be configured as one color, for example,red color.

The first contact frame adhering step ST5300 adheres the first contactframe to a first donor film using magnetic attraction. The first contactframe includes magnets or magnetic substance. First opening grooves areformed at the first contact frame, and a laser for transferring a firstcolor organic light emission layer passes through the first openinggrooves. Here, a contact frame feed mechanism first feeds and adheresthe first contact frame on the substrate stage, and then adheres itstrongly using magnetic attraction.

The first sub-pixel transfer step ST5400 expands and transfers a firstcolor organic light emission layer included in the first donor film on afirst sub-pixel region of the acceptor substrate by irradiating a laseron the first donor film through the first opening grooves of the firstcontact frame. At this time, an irradiation range of the laser can beadjusted so that the laser is irradiated to only the first sub-pixelregion among regions corresponding to the opening grooves.

The first contact frame separating step ST5500 separates the firstcontact frame from the first donor film by first separating the firstcontact frame by a magnetic repulsive force, and then by raising thecontact frame to an upper portion of the chamber by the contact framefeed mechanism.

The second donor film feed step ST5600 removes the first donor film froman upper portion of the acceptor substrate to an outside of the chamber,and feeds a second donor film having a second color organic lightemission layer on the acceptor substrate. That is, the donor film feedmechanism substitutes a second donor film for the first donor film.

The first contact frame re-adhering step ST5700 again adheres the firstcontact frame separated from the donor film in step ST5500 to a seconddonor film using magnetic attraction. Here, the contact frame feedmechanism first feeds and adheres the first contact frame on thesubstrate stage, and then adheres it strongly using magnetic attraction.

The second sub-pixel transfer step ST5800 expands and transfers a secondcolor organic light emission layer included in the second donor film ona second sub-pixel region of the acceptor substrate by irradiating alaser on the second donor film through the opening grooves of the firstcontact frame. At this time, an irradiation range of the laser can beadjusted so that the laser is irradiated to only the second sub-pixelregion among regions corresponding to the opening grooves.

The second contact frame exchange step ST5900 eliminates a magneticforce or generates a magnetic repulsive force between the first contactframe and the substrate stage to separate the first contact frame fromthe second donor film, and then substitutes the second contact frame forthe first contact frame. The second contact frame has magnets ormagnetic substance. Opening grooves are formed at the second contactframe and a laser for transferring a third color organic light emissionlayer of the third donor film passes through the opening grooves.

The third donor film feed step ST6000 removes the second donor film froman upper portion of the acceptor substrate to an outside of the chamber,and feeds a third donor film having a third color organic light emissionlayer on the acceptor substrate. That is, the donor film feed mechanismsubstitutes a third donor film for the second donor film.

The third contact frame adhering step ST6100 adheres the second contactframe to the third donor film using magnetic attraction. The secondcontact frame includes magnets or magnetic substance. Second openinggrooves are formed at the second contact frame, and a laser fortransferring a third color organic light emission layer passes throughthe third opening grooves. Here, a contact frame feed mechanism firstfeeds and adheres the second contact frame on the substrate stage, andthen adheres it strongly using magnetic attraction.

The third sub-pixel transfer step ST6200 expands and transfers a thirdcolor organic light emission layer included in the third donor film on athird sub-pixel region of the acceptor substrate by irradiating a laseron the third donor film through opening grooves of the second contactframe. At this time, an irradiation range of the laser can be adjustedso that the laser is irradiated to an entire region of the secondcontact frame.

An organic light emission layer can be variously transferred at a pixeldefinition region in respective transfer steps. A laser irradiationmethod can vary according to an arrangement of a transfer. For example,the four sub-pixels form a 2×2 matrix, and constitutes one pixel, thefirst color organic light emission layer is transferred to be formed atan upper left end of the pixel in the first sub-pixel transfer stepST5400, and the second color organic light emission layer is transferredto be formed at a left side of the first sub-pixel in the secondsub-pixel transfer step ST5800, and the third color organic lightemission layer is transferred to be formed under the first and secondsub-pixels in the third sub-pixel transfer step ST6200. Further, thefirst color organic light emission layer is transferred to be formed atan upper left end of the pixel in the first sub-pixel transfer stepST5400, and the second color organic light emission layer is transferredto be formed under the first sub-pixel in the second sub-pixel transferstep ST5800, and the third color organic light emission layer istransferred to be formed at each right side of the first and secondsub-pixels in the third sub-pixel transfer step ST6200.

In the described embodiment, a color defining two sub-pixels is blue.For example, a color of the first color organic light emission layertransferred in the first sub-pixel transfer step ST5400 is red, a colorof the second color organic light emission layer transferred in thesecond sub-pixel transfer step ST5800 is green, and a color of the firstcolor organic light emission layer transferred in the third sub-pixeltransfer step ST6200 is blue. Alternatively, a color of the first colororganic light emission layer transferred in the first sub-pixel transferstep ST5400 may be green, a color of the second color organic lightemission layer transferred in the second sub-pixel transfer step ST5800may be red, and a color of the third color organic light emission layertransferred in the third sub-pixel transfer step ST6200 is blue.

Embodiment 6

Hereinafter, since an acceptor substrate and contact frames differ fromthose of the first embodiment, only the acceptor substrate and thecontact frames will be described in detail.

FIG. 15A, FIG. 15B and FIG. 15C are plan views showing one example of afirst contact frame, one example of a second contact frame, and oneexample of a third contact frame according to a sixth embodiment of thepresent invention, respectively.

Referring to FIGS. 15A-15C, each of the first to third contact frames130 a_6, 130 b_6, and 130 c_6 includes at least one of a permanentmagnet, magnetic substance, or an electromagnet 137 a_6, 137 b_6 or 137c_6, and at least one of opening grooves 133 a_6, 133 b_6, or 133 c_6.The permanent magnet, the magnetic substance, or the electromagnet isprovided at the first to third contact frames 130 a_6, 130 b_6, and 130c_6, and forms a magnetic force with a magnet 113 of a substrate stage110 shown in FIGS. 3A and 3B. The permanent magnet, the magneticsubstance, or the electromagnet is positioned between the openinggrooves 133 a_6, 133 b_6, or 133 c_6. Here, the magnetic substanceincludes ferromagnetic substance and/or weak magnetic substance. In thedescribed embodiment, the magnetic substance is formed by one selectedfrom the group consisting of Fe, Ni, Cr, Fe₂O₃, Fe₃O₄, CoFe₂O₄, magneticnano particle, and a mixture thereof. When the magnet is anelectromagnet, an electric wiring should be further formed at eachelectromagnet.

The opening grooves 133 a_6, 133 b_6, or 133 c_6 can be variously setaccording to a pixel array having an organic light emission layer to betransferred. When a first sub-pixel, a second sub-pixel, and two thirdsub-pixels arranged in a 2×2 matrix constitute one pixel, and aplurality of pixels constitute a pixel portion, as shown in FIG. 15A,the first contact frame 130 a_6 includes opening grooves 133 a_6 atformation positions of the first sub-pixels. As shown in FIG. 15B, thesecond contact frame 130 b_6 includes opening grooves 133 b_6 atformation positions of the second sub-pixels. As shown in FIG. 15C, thethird contact frame 130 c_6 includes common opening grooves 133 c_6 atformation positions of the two third sub-pixels. The opening grooves 133c_6 of the third contact frame 130 c_6 are formed so that the thirdsub-pixels are positioned on the same line. The opening grooves 133 a_6,133 b_6, and 133 c_6 of the first to third contact frames 130 a_6, 130b_6, and 130 c_6 are formed so that they are not overlapped with eachother when the first to third contact frames 130 a_6, 130 b_6, and 130 c6 are overlapped with each other. In the described embodiment, thefirst, second, and third sub-pixels are red, green, and blue,respectively. However, the present invention is not limited thereto. Inthis case, each of the first to third contact frames 130 a_6, 130 b_6,and 130 c_6 also functions as a mask to form the first to thirdsub-pixels.

Referring to FIG. 15D showing a pixel array of an organic light emittingdisplay device having an emission layer formed on an acceptor substrate307 by the first to third contact frames 130 a_6, 130 b_6, and 130 c_6,a pixel portion includes a plurality of pixels, each of which isconfigured by one first sub-pixel, one second sub-pixel, and two thirdsub-pixels. In the pixel, the first to third sub-pixels are arranged ina 2×2 matrix. The first sub-pixel is positioned at a first row and afirst column, the second sub-pixel is positioned at a second row and afirst column, and the two third sub-pixels are positioned at a secondcolumn. In the described embodiment, the first to third sub-pixels arered, green, and blue, respectively. In another embodiment, when thefirst one sub-pixel, the second one sub-pixel, and the two thirdsub-pixels are arranged in a 2×2 matrix, the two third sub-pixels can beat the second row. In this case, as shown in FIGS. 15E, 15F and 15G, thelaser induced thermal imaging apparatus includes first to third contactframes 130 e_6, 130 f_6 and 130 g_6.

As shown in FIG. 15E, the opening grooves 133 e_6 are formed atformation positions of the first sub-pixels in the first contact frame130 e_6. As shown in FIG. 15F, the opening grooves 133 f_6 are formed atformation positions of the second sub-pixels in the second contact frame130 f_6. As shown in FIG. 15G, the opening grooves 133 g_6 are formed atformation positions of the two third sub-pixels in the third contactframe 130 g_6. The opening grooves 133 g_6 of the third contact frame130 g_6 are formed so that the third sub-pixels are positioned at thesame row. In other words, as shown in FIG. 15H, the first sub-pixel ispositioned at a first row and a first column, the second sub-pixel ispositioned at a first row and a second column, and the third sub-pixelsare positioned at the second row. In the described embodiment, the firstto third sub-pixels are red, green, and blue, respectively.

When one red sub-pixel, one green sub-pixel, and two blue sub-pixelsconstitute one pixel, by compensating emission efficiency of the bluesub-pixels having the lowest emission efficiency, a balance ofrespective sub-pixels can be adjusted and a color reproducibility may beincreased.

Moreover, when respective sub-pixels are formed using different contactframes, opening grooves are formed at only formation positions of thesame color sub-pixels in the same contact frame. This case has moreparts including magnets or magnetic substance in comparison with a casethat opening grooves corresponding to sub-pixels of two or more colorsare formed at one contact frame, and a laminating effect due to amagnetic force is increased.

FIG. 16 is a flow diagram that illustrates a fabricating method oforganic light emitting diodes according to the sixth embodiment of thepresent invention. A fabricating method of the organic light emittingdiodes of FIG. 16 will be described in reference to fabricating onepixel of an organic light emitting display device. Each pixel of theorganic light emitting display device includes first to thirdsub-pixels, and an emission layer included in respective sub-pixels isformed by a laser induced thermal imaging process.

With reference to FIG. 16, a laser induced thermal imaging method forforming a pixel of organic light emitting diodes by the laser inducedthermal imaging apparatus according to an embodiment of the presentinvention includes an acceptor substrate feed step ST7100, a first donorfilm feed step ST7200, a first contact frame adhering step ST7300, afirst sub-pixel transfer step ST7400, a second contact frame exchangestep ST7500, a second donor film feed step ST7600, a second contactframe adhering step ST7700, a second sub-pixel transfer step ST7800, asecond contact frame separating step ST7900, a third donor film feedstep ST8000, a third contact frame adhering step ST8100, and a thirdsub-pixel transfer step ST8200.

Hereinafter, a laser induced thermal imaging method will be illustratedwith reference to FIG. 16 and FIG. 2 showing a perspective view of thelaser induced thermal imaging apparatus.

The acceptor substrate feed step ST7100 feeds an acceptor substrate 307or 308 in a first mounting groove 450 of a substrate stage 110 havingmagnets or magnetic substance. An organic light emission layer is formedat the acceptor substrate 307 or 308. A pixel region is defined at theacceptor substrate 307 or 308. An emission layer to be transferred fromthe donor film 200, is formed corresponding to the pixel region. Onefirst sub-pixel, one second sub-pixel, and two third sub-pixels arearranged at the pixel region of the acceptor substrate 307 or 308 in a2×2 matrix, and constitute one pixel.

The first donor film feed step ST7200 feeds the first donor film on theacceptor substrate 307 or 308. Here, the first donor film includes anemission layer to be transferred at the first sub-pixel region of theacceptor substrate 307 or 308. At this time, the emission layer can beconfigured as a first color, for example, a red color.

The first contact frame adhering step ST7300 adheres the first contactframe 130 a_6 to the first donor film using magnetic attraction. Thefirst contact frame 130 a_6 includes magnets or magnetic substance 137a_6. Opening grooves 133 a_6 are formed at the first contact frame 130a_6, and a laser for transferring a first color organic light emissionlayer passes through the opening grooves. In the described embodiment, acontact frame feed mechanism first feeds and adheres the first contactframe 130 a_6 on the substrate stage 110, and then adheres it stronglyusing magnetic attraction between the substrate stage 110 and the firstcontact frame 130 a_6.

The first sub-pixel transfer step ST7400 expands and transfers a firstcolor organic light emission layer included in the first donor film on afirst sub-pixel region of the acceptor substrate 307 or 308 byirradiating a laser from a laser oscillator 120 on the first donor filmthrough the first opening grooves of the first contact frame 130 a_6. Atthis time, an irradiation range of the laser can be adjusted so that thelaser is irradiated to only the first sub-pixel region among regionscorresponding to the opening grooves.

The second contact frame exchange step ST7500 eliminates a magneticforce or generates a magnetic repulsive force between the first contactframe 130 a_6 and the substrate stage 220 to separate the first contactframe 130 a_6 from the first donor film, and then substitutes the secondcontact frame 130 b_6 for the first contact frame 130 a_6. The secondcontact frame 130 b_6 has magnets or magnetic substance. Opening grooves133 b_6 are formed at the second contact frame 130 b_6 and a laser fortransferring a second color organic light emission layer of the seconddonor film passes through the opening grooves.

The second donor film feed step ST7600 removes the first donor film froman upper portion of the acceptor substrate 307 or 308 to an outside ofthe chamber 150, and feeds a second donor film on the acceptor substrate307 or 308. The second donor film includes an emission layer to betransferred at the second sub-pixel region of the acceptor substrate 307or 308. At this time, the emission layer can be configured as a secondcolor, for example, a green color.

The second contact frame adhering step ST7700 adheres the second contactframe 130 b_6 to the second donor film using magnetic attraction.

The second sub-pixel transfer step ST7800 expands and transfers a secondcolor organic light emission layer included in the second donor film onthe second sub-pixel region of the acceptor substrate 307 or 308 byirradiating a laser from the laser oscillator 120 on the second donorfilm through the opening grooves 133 b_6 of the second contact frame 130b_6.

The second contact frame separating step ST7900 eliminates a magneticforce or generates a magnetic repulsive force between the second contactframe 130 b_6 and the substrate stage 110 to separate the second contactframe 130 b_6 from the second donor film, and then substitutes the thirdcontact frame 130 c 6 for the second contact frame 130 b_6. The thirdcontact frame 130 c_6 has magnets or magnetic substance. Opening groovesare formed at the third contact frame 130 c_6 and a laser fortransferring a third color organic light emission layer of the thirddonor film passes through the opening grooves.

The third donor film feed step ST8000 removes the second donor film froman upper portion of the acceptor substrate 307 or 308 to an outside ofthe chamber 150, and feeds a third donor film on the acceptor substrate307 or 308. The third donor film includes an emission layer to betransferred at the third sub-pixel region of the acceptor substrate 307or 308. In the described embodiment, the emission layer can beconfigured as a third color, for example, a blue color.

The third contact frame adhering step ST8100 adheres the third contactframe 130 c_6 to the third donor film using magnetic attraction.

The third sub-pixel transfer step ST8200 expands and transfers a thirdcolor organic light emission layer included in the third donor film onthe third sub-pixel region of the acceptor substrate 307 or 308 byirradiating a laser from the laser oscillator 120 on the third donorfilm through the opening grooves of the third contact frame 130 c_6.

The steps can be performed in a process chamber 150, and a laserirradiation method can vary according to an arrangement of an organiclight emission layer to be transferred in respective transfer steps. Forexample, when one first sub-pixel, one second sub-pixel, and two thirdsub-pixels arranged in a 2×2 matrix constitute one pixel, a laser isirradiated to form the first sub-pixel at a first row and a first columnin the first sub-pixel transfer step ST7400. Further, the laser isirradiated to form the second sub-pixel at a first row and a secondcolumn in the second sub-pixel transfer step ST7800, and the laser isirradiated to form the two third sub-pixels at a second row and a firstcolumn in the third sub-pixel transfer step ST8200. Alternatively, thelaser may be irradiated to form the first sub-pixel at a first row and afirst column in the first sub-pixel transfer step ST7400, the laser maybe irradiated to form the second sub-pixel at a second row and a firstcolumn in the second sub-pixel transfer step ST7800, and the laser maybe irradiated to form the two third sub-pixels at a first row and asecond column, and the second row and the second column in the thirdsub-pixel transfer step ST8200. In the described embodiment, the firstand second sub-pixels are red and green, respectively, and the two thirdsub-pixels are blue.

Although certain exemplary embodiments of the present invention havebeen shown and described, it would be appreciated by those skilled inthe art that changes might be made in these embodiments withoutdeparting from the principles or spirit of the invention, the scope ofwhich is defined in the claims and their equivalents. For example, evenwhen the pixel array is a mosaic or stripe type, as in the thirdembodiment, an organic light emission layer may be formed by two contactframes. Furthermore, it would be appreciated by those skilled in the artthat changes may be made when at least three sub-pixels form one pixel.

What is claimed is:
 1. A method for fabricating organic light emittingdiodes, each organic light emitting diode having an emission layerformed between first and second electrodes, the method comprising: usinga laser induced thermal imaging apparatus comprising: a substrate stageincluding a magnet or magnetic substance, the substrate stage beingadapted to receive an acceptor substrate and a donor film to belaminated to each other on the substrate stage, the acceptor substratehaving a pixel region for forming pixels, each pixel comprising a firstsub-pixel, a second sub-pixel, and two third sub-pixels, the donor filmhaving an organic light emission layer to be transferred to the pixelregion; a laser oscillator for irradiating a laser to the donor film; acontact frame adapted to be disposed between the substrate stage and thelaser oscillator, and adapted to form a magnetic force with thesubstrate stage, and including an opening through which the laserpasses; and a contact frame feed mechanism for moving the contact framein a direction of the substrate stage, wherein the contact frameincludes first and second frames, first and second openings are formedrespectively at the first and second frames, the first and secondsub-pixels are formed corresponding to the first opening, and two thirdsub-pixels are formed corresponding to the second opening, wherein thefirst and second frames are alternately mounted to form emission layersof organic light emitting diodes corresponding to the first, second andthird sub-pixels, wherein the contact frame comprises a first contactframe and a second contact frame, and the donor film comprises a firstdonor film having a first color organic light emission layer, a seconddonor film having a second color organic light emission layer, and athird donor film having a third color organic light emission layer,placing the acceptor substrate on the substrate stage having a magnet,the acceptor substrate having the pixel region comprising a firstsub-pixel region for forming the first sub-pixel, a second sub-pixelregion for forming the second sub-pixel, and two third sub-pixel regionsfor forming the two third sub-pixels, wherein one pixel comprises onefirst sub-pixel, one second sub-pixel and two third sub-pixels; placingthe first donor film having the first organic light emission layer onthe acceptor substrate; adhering the first contact frame having a magnetto the first donor film using magnetic attraction, the first contactframe having an opening; irradiating the laser to the first donor filmthrough the opening of the first contact frame to transfer the firstcolor organic light emission layer to the first sub-pixel region;separating the first contact frame from the first donor film; placingthe second donor film having the second color organic light emissionlayer on the acceptor substrate; adhering the first contact frame to thesecond donor film using magnetic attraction; irradiating the laser tothe second donor film through the opening of the first contact frame totransfer the second color organic light emission layer to the secondsub-pixel region; separating the first contact frame from the seconddonor film, and substituting the first contact frame with the secondcontact frame, the second contact frame including a magnet, and havingan opening; placing the third donor film having the third color organiclight emission layer on the acceptor substrate; adhering the secondcontact frame to the third donor film using magnetic attraction; andirradiating the laser on the third donor film through the opening of thesecond contact frame to transfer the third color organic light emissionlayer to the two third sub-pixel regions.
 2. The method according toclaim 1, wherein the four sub-pixels of one pixel form a 2×2 matrix,wherein the first color organic light emission layer is transferred toform the first sub-pixel at an upper left corner of the pixel, thesecond color organic light emission layer is transferred to form thesecond sub-pixel at a right side of the first sub-pixel, and the thirdcolor organic light emission layer is transferred to form the two thirdsub-pixels under the first and second sub-pixels.
 3. The methodaccording to claim 1, wherein the four sub-pixels of one pixel form a2×2 matrix, wherein the first color organic light emission layer istransferred to form the first sub-pixel at an upper left corner of thepixel, the second color organic light emission layer is transferred toform the second sub-pixel under the first sub-pixel, and the third colororganic light emission layer is transferred to form the two thirdsub-pixels at right side of the first and second sub-pixels.
 4. Themethod according to claim 2, wherein the first color organic lightemission layer is adapted to emit a red color light, the second colororganic light emission layer is adapted to emit a green color light, andthe third color organic light emission layer is adapted to emit a bluecolor light.
 5. The method according to claim 2, wherein the first colororganic light emission layer is adapted to emit a green color light, thesecond color organic light emission layer is adapted to emit a red colorlight, and the third color organic light emission layer is adapted toemit a blue color light.